050-4922 rev b 10-2003 maximum ratings all ratings: t c = 25c unless otherwise specified. static electrical characteristics symbol bv dss v ds (on) i dss i gss g fs v isolation v gs (th) characteristic / test conditions drain-source breakdown voltage (v gs = 0v, i d = 250 a) on state drain voltage 1 (i d (on) = 12.5a, v gs = 10v) zero gate voltage drain current (v ds = v dss , v gs = 0v) zero gate voltage drain current (v ds = 0.8 v dss , v gs = 0v, t c = 125c) gate-source leakage current (v gs = 30v, v ds = 0v) forward transconductance (v ds = 25v, i d = 12.5a) rms voltage (60hz sinewave from terminals to mounting surface for 1 minute) gate threshold voltage (v ds = v gs , i d = 50ma) min typ max 1200 11.5 14 100 1000 400 810 2500 6812 unit volts a na mhos volts symbol v dss i d v gs p d t j ,t stg t l parameter drain-source voltage continuous drain current @ t c = 25c gate-source voltage total device dissipation @ t c = 25c operating and storage junction temperature range lead temperature: 0.063" from case for 10 sec. arf 1505 1200 25 30 1500 -55 to 200 300 unit volts amps volts watts c rf power mosfet n - channel enhancement mode 300v 750w 40mhz the ARF1505 is an rf power transistor designed for off-line 300v operation in very high power scientific, commercial, medical and industrial rf power generator and amplifier applications up to 40 mhz. ? specified 300 volt, 27.12 mhz characteristics: ? output power = 750 watts. ? gain = 17db (class c) ? efficiency > 75% ? high performance power rf package. ? very high breakdown for improved ruggedness. ? low thermal resistance. ? nitride passivated die for improved reliability. ARF1505 caution: these devices are sensitive to electrostatic discharge. proper handling procedures should be followed. apt website - http://www.advancedpower.com thermal characteristics symbol r jc r cs characteristic (per package unless otherwise noted) junction to case case to sink (use high efficiency thermal joint compound and planar heat sink surface.) min typ max 0.12 0.09 unit c/w d s g volts ds s gs s arf1500 beo 1525-xx ss s s g d
050-4922 rev b 10-2003 dynamic characteristics ARF1505 symbol c iss c oss c rss t d(on) t r t d(off) t f characteristic input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time test conditions v gs = 0v v ds = 200v f = 1 mhz v gs = 15v v dd = 0.5 v dss i d = i d[cont.] @ 25c r g = 1.6 ? min typ max 5400 6500 300 400 125 160 8 5 25 13 unit pf ns functional characteristics symbol g ps test conditions f = 27.12 mhz v gs = 0v v dd = 300v p out = 750w no degradation in output power characteristic common source amplifier power gain drain efficiency electrical ruggedness vswr 10:1 min typ max 15 17 70 75 unit db % 1 pulse test: pulse width < 380 s, duty cycle < 2%. apt reserves the right to change, without notice, the specifications and information contained herein. typical large signal input - ouput impedance characteristics f (mhz) z in ( ? )z ol ( ? ) 2.0 13.5 27 40 5.4 - j 9.6 0.30 - j 1.2 0.26 + j .58 0.36 + j 1.6 46 - j 10.5 16.4 - j 23 4.9 - j 14.6 2.3 - j 10.3 z in - gate shunted with 25 ? z ol - conjugate of optimum load for 750 watts output i dq = 100ma v dd = 300v hazardous material warning the ceramic portion of the device between leads and mounting surface is beryllium oxide, beo. beryllium oxide dust is toxic when in- haled. care must be taken during handling and mounting to avoid damage to this area . these devices must never be thrown away with general industrial or domestic waste. thermal considerations and package mounting: the rated 1500w power dissipation is only avail- able when the package mounting surface is at 25 c and the junction temperature is 200 c. the thermal resistance between junctions and case mounting surface is 0.12 c/w. when installed, an additional thermal impedance of 0.1 c/w between the package base and the mounting surface is typi- cal. insure that the mounting surface is smooth and flat. thermal joint compound must be used to reduce the effects of small surface irregularities. the heatsink should incorporate a copper heat spreader to obtain best results. the package is designed to be clamped to a heatsink. a clamped joint maintains the required mounting pressure while allowing for thermal ex- pansion of both the device and the heat sink. a simple clamp, and two 6-32 (m3.5) screws can pro- vide the minimum 125 lb required mounting force. t = 12 in-lb. clamp heat sink d s s g s s d g s s s s arf15-- beo 1525-xx .005 .045 .250 .500 .500 1.065 .207 .207 .375 .105 typ. 1.065 d s g
050-4922 rev b 10-2003 rf input l3 l1 output c7 c8 c9 c10 l4 c4 c5 c12 c6 c1, c7,c8, c11 .047 uf 500v ceramic disc c2, c12 arco 465 75-380pf mica trimmer c3 2x 4700pf atc 700b c4, c9-c10 8200pf 500v npo ceramic c5 200 pf atc 100e c6 150 pf atc 700b l1 90 nh 4t #18 0.25"d .25" l l2 200 nh - 3t #8 1" dia 1" l l3 6 uh - 22t #24 enam. 0.5" dia. l4 500 nh 2t on 850u .5" bead r1-r3 1k ? 1/4w tl1 .112" x 1 " (50 ?) stripline ARF1505 -- 27.12 mhz test circuit 300v vbias c1 c2 c3 c11 r1 r2 r3 l2 tl1 27 mhz amp ARF1505 rf 12-02 arf1500 beo 135-05 j1 j2 ARF1505 201 27 mhz amp ARF1505 rf 12-02
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